I’m new to molflow+ software and I’m trying to understand what can be simulated with this tool and what cannot.
I saw in the documentation that sputter deposition could be simulated, so I was wondering if physical evaporation of a material could be possible (at low pressure, i.e. we’re still in a molecular regime). Has anyone ever done this?
Another question: if I simulate a gas injection of a few sccm into a multi-hole ring inside a vacuum chamber. Can I still see the angular distribution of the gas leaving each hole? Any advice before starting the simulation?
What exactly is the process you’re trying to model?
There is a tutorial for sputtering simulations (https://molflow.web.cern.ch/node/370), where the particles stick immediately on the wall.
If you’d like to create new particles at the incidence locations, you have to either use a sticking factor (linear yield), or record a texture and convert it to your own (custom) outgassing map (see here: https://molflow.web.cern.ch/node/69).
For the second question, yes, you can set up as many transparent sampling facets as you’d like, and record the angular distribution on each.
Good luck, and let us know if you have concrete questions on the simulations (you can even attach the geometry).